Prekės informacija
Bendrosios charakteristikos
Prekės tipas
Pagrindinės plokštės matmenys
Ilgis
224 mm
Plotis
224 mm
Plokštės dydis
Procesorius
Procesoriaus tipas
Procesoriaus lizdo tipas
Procesoriaus lizdų skaičius
1
Operatyvioji atmintis
Operatyviosios atminties lizdų kiekis
4
Operatyviosios atminties tipas
Maksimalus operatyviosios atminties kiekis (RAM)
Operatyviosios atminties taktinis dažnis
Garsas, vaizdas ir tinklo plokštė
Garso plokštės modelis
Realtek HD
Tinklo plokštė
Realtek® 2.5GbE
AMD CrossFire
Ne
nVidia SLI
Ne
Kietojo disko ir optinių įrenginių pajungimas
M.2 lizdų skaičius
4
Išplėtimo lizdai
PCI Express 1X jungtys
1
PCI Express 4X jungtys
2
PCI Express 16X jungtys
1
Galimos galinės dalies jungtys
USB 2.0 jungčių skaičius
2
USB 3.x jungčių skaičius
4
Ethernet LAN (RJ-45) lizdas
Taip
D-Sub jungtys
0
DVI jungtys
0
HDMI lizdų skaičius
1
DisplayPort jungtys
2
PS/2 jungtys
1
Papildomai
Garantija
24 mėn
Prekės atspalvis gali skirtis nuo matomo nuotraukoje.
To ensure maximum Turbo Boost and overclocking performance of AMD's new generation CPU, GIGABYTE Gaming series motherboard equip the best VRM design ever built with the highest quality components.
GIGABYTE B650 Motherboards are ready to work with the PCIe 4.0 devices which are expected to experience twice bandwidth than the current PCIe 3.0 devices. To reach the high speed and maintain good signal integrity, GIGABYTE R&D uses the low impedance PCB to provide the maximum performance.
DDR5 EXPO & XMP Overclocking Up to 6400 and Beyond*
AORUS is offering a tested and proven platform that the memory overclocking capability is able up to 6400 and beyond. All users need to do for achieving this extreme memory performance boost is to ensure that their DDR5 memory modules are AMD EXPO™/ Intel® XMP capable, the EXPO/XMP function is activated and enabled on their AORUS motherboard.
THERMAL
OUTSTANDING THERMAL DESIGN
GIGABYTE MOTHERBOARDS' UN-THROTTLED PERFORMANCE IS GUARANTEED BY INNOVATIVE AND OPTIMIZED THERMAL DESIGN TO ENSURE THE BEST CPU, CHIPSET, SSD STABILITY AND LOW TEMPERATURES UNDER FULL LOAD APPLICATION AND GAMING PERFORMANCE.
High coverage MOSFET and integrated molding Heatsinks to improve thermal efficiency with better airflow and heat exchange.The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.2X copper PCBs design effectively lower the component temperature by its high thermal conductivity and low impedance.
3X Large Surface
Increased surface area up to 3X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.Real One-piece Build
TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors' multi-piece design.
SMART FAN 6
Smart Fan 6 contains several unique cooling features that ensure gaming PC maintain its performance while staying cool and quiet. Multiple fan headers can support PWM/DC fan and pump, and users can easily define each fan curve based on different temperature sensors across the board via intuitive user interface.
Cooling Features
High Current Support
Each fan headers support PWM and DC fan and Water Cooling Pump , and up to 24W (12V x 2A) with Over-Current Protection
Precision Control
Multiple temperature/fan speed control points for precise fan curve
Dual Curve Mode
Slope/Stair dual mode for different user scenario
Fan Stop
Fan can stop completely below users' specified temperature point
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